State-of-the-art thin-film circuit processing and fabrication. Inductor Coils, Microstrip Transmission Lines, Stand Off/Isolation Pads. Build-to-print services for a wide range of materials and metallization schemes. ATP fabricates circuits on substrates using As-Fired Alumina, Polished Alumina, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz, Sapphire and Hi-K Dielectrics. Metallizations range from standard films to Aluminum, Chrome, Copper, Nickel, Gold, Palladium, Platinum, Titanium and Titanium Tungsten. Circuit features can include fine pitch conductors, integrated resistors, vias, wrap-arounds, double sided patterning, polyimide supported bridges, hollow plated vias and solid filled vias.
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